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DPA26TZ06-DV004Department of Defense — DARPA

DARPA DPA26TZ06-DV004 — Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)

Deadline
· 41d
Award ceiling
Not stated
Awards
Not stated
Posted
Sep 23, 2026

Official announcement on dod_dsip · opens the funder's page. Always confirm dates there.

Summary

Develop and demonstrate novel nanofabrication hard-mask materials that exhibit substantially improved plasma etch resistance, enabling the implementation of extreme high-aspect-ratio structures with excellent pattern-transfer fidelity, minimal sidewall roughness, and precise dimensional control. […]

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Source record: https://www.dodsbirsttr.mil/topics-app/?topicId=35b26ba542ed4eff81d02c2d37c48aec_86676Via dod_dsip. Always confirm dates with the funder.