OSD OSW26BZ05-NV021 — Co-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging
- · 12d
- Not stated
- Not stated
- Aug 26, 2026
Official announcement on dod_dsip · opens the funder's page. Always confirm dates there.
Summary
Model, design, and produce a readout integrated circuit with a photonic digital output for an infrared sensor demonstration in a cryogenic environment.
Other topics in this solicitation
OSD OSW26BZ05-DV014 — In-Situ Metrology for Mesa-Wall Integrity in Large Format Small-Pixel Infrared Detector Array Fabrication
OSD OSW26BZ05-DV018 — Artificial Intelligence / Machine Learning (AI/ML)-Based Radar Data Compression
OSD OSW26BZ05-DV022 — Signal Classification and Anomaly Detection in Contested Spectral Environments
OSD OSW26BZ05-DV023 — Quantum Sensor Gravity Data Production & Analysis for Maritime Floor Mapping
OSD OSW26BZ05-DV019 — Collaborative Distributed Swarm Radar
OSD OSW26BZ05-NV017 — Sensing Algorithms for Bandwidth Efficient Edge Radars (SABER)
OSD OSW26BZ05-NV016 — Desktop Instrument for Measuring Boresight Error as a Function of Incident Angle
OSD OSW26BZ05-DV020 — Joint Radar & Communication Waveforms
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More from Department of Defense — OSD
OSD OSW26BZ05-DV018 — Artificial Intelligence / Machine Learning (AI/ML)-Based Radar Data Compression
OSD OSW26BZ05-DV022 — Signal Classification and Anomaly Detection in Contested Spectral Environments
OSD OSW26BZ05-DV014 — In-Situ Metrology for Mesa-Wall Integrity in Large Format Small-Pixel Infrared Detector Array Fabrication
OSD OSW26BZ05-DV023 — Quantum Sensor Gravity Data Production & Analysis for Maritime Floor Mapping
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